So, this recent tech marriage between the Korean electronics giant and Corning of Gorilla Glass fame shouldn't come as much surprise for fans of super saturated screens. The substrate, heralded for its ability to withstand "higher processing temperatures" without compromising structural stability, will help create a range of less power consumptive, high-resolution devices.
Moreover, the conductive through holes are formed by forming plural through holes through electrolyzing, and then forming a first seed layer and a first metal layer inside the through holes. Therefore, the problem of substrate warpage can be prevented, and the wiring density of the flip-chip substrate can be improved.
Field of the Invention The present invention relates to a flip-chip substrate, and, more particularly, to a flip-chip substrate capable of avoiding substrate warpage. Description of Related Art As the electronic industry develops rapidly, research moves towards electronic devices with multifunctions and high efficiency.
Hence, circuit boards with many active and passive components and circuit connections thereon have been transformed from double-layered boards to multiple-layered boards so that the requirements such as integration and miniaturization in semiconductor packaging substrate can be met.
Furthermore, interlayer connection technique is also applied in this field to expand circuit layout space in a limited circuit board and to meet the demand of the application of high-density integrated circuits. For manufacturing conventional semiconductor packaging structures, a chip is mounted on the top surface of a substrate first, and then connected thereto by wire bonding.
Alternatively, the chip is connected with the substrate by flip chip technique. Subsequently, solder balls are disposed on the bottom surface of the substrate and electrically connected to a printed circuit board.
The core board 11 has to be made of an insulating material. As shown in FIG. Generally, the through holes 11 a are formed by a mechanical method such as drilling. With reference to FIG. Then, the through holes 11 a are filled with a resin With regard to FIG.
I E, the metal layer 12 and the seed layer not shown which is not covered by the patterned resist layer 14 is removed by etching, and the patterned resist layer 14 is then removed after completing the steps illustrated above.
Therefore, the patterned metal layer 12 located on the top and bottom surface of the core board 11 functions as circuit layers 12 a of a flip-chip substrate. Alternatively, the patterned metal layer 12 located on the inner surface of the through holes 11 a functions to electrically connect the circuit layers 12 a.
Each built-up structure 91 primarily comprises at least one dielectric layer 91 a and at least one metal layer 91 b stacked alternately. The process of forming the built-up structure is well known in this field and, therefore, detailed steps of a built-up process are not described herein.
Subsequently, solder masks 41 having a plurality of openings are formed on the surface of the built-up structures Accordingly, partial metal layers 91 b of the built-up structure 91 are exposed in the openings to function as conductive pads. Finally, pluralities of solder bumps 42 are formed on the conductive pads to complete a flip-chip substrate.
Moreover, the solder bumps 42 at different sides of the flip-chip substrate have different diameters. The solder bumps 42 at the bottom side of the flip-chip substrate are bigger in diameter so as to act as solder balls which are electrically connected to a printed circuit board.
The solder bumps 42 at the top side of the flip-chip substrate are smaller in diameter so as to electrically connect to chips.
So far in the application in industry, the material of the core board 11 is mostly made of BT resin, and the material of the dielectric layer 91 a is mostly made of ABF Ajinomoto build-up film resin. The CET difference causes substrate warpage to the flip-chip substrate such that the yield and the reliability are both reduced.
In addition, the through holes of the flip-chip substrate are generally formed by drilling. Accordingly, it is desirable to provide a new material suitable for manufacturing a flip-chip substrate to prevent substrate warpage, to reduce the diameter of through holes, and to increase the yield of flip-chip substrate.
SUMMARY OF THE INVENTION The present invention provides a flip-chip substrate using aluminum oxide, which has excellent thermal properties and mechanical properties for example, the Young's modulus of aluminum oxide is Gpaas the material of the core board to prevent substrate warpage, to achieve a fine-patterned circuit layout, and to improve the dimensional stability of the flip-chip substrate.
In addition, the through holes of the flip-chip substrate using aluminum oxide as the core board's material can be formed by electrolysis without drilling, or other related conventional method for forming through holes in a core board. One aspect of the present invention provides a flip-chip substrate comprising: In the flip-chip substrate of the present invention, the structure of the conductive through holes is not limited as long as the conductive through holes electrically connects with the first circuit layer disposed on the top and bottom surfaces of the aluminum oxide board.
In one preferred embodiment, the conductive through holes comprise the first seed layer formed on the inner surface of the through holes and the first metal layer fills the through holes.
In another preferred embodiment, the conductive through holes comprise the first seed layer formed on the inner surface of the through holes, the first metal layer formed inside the through holes, and the filler fills the through holes.
Moreover, the material of the first metal layer is not limited.Prior art keywords holes flip layer chip substrate aluminum oxide Prior art date Legal status (The legal status is an assumption and is not a legal conclusion. Mar 02, · 03/02/ am ET Updated May 02, Samsung also said it was disappointed by the fact that the court also dismissed its patent case against Apple, which concerned 3G/UMTS-essential.
Samsung focuses on collecting and evaluating ideas for new product concepts from all stakeholders in an effort to develop the optimum storehouse of information and ideas from which to create cutting edge electronic technology.
There has been a lot of debate on what Samsung will be showing at the upcoming Mobile World Congress in Barcelona this month, after the company confirmed that .
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